Thermal conductivity (λ)
Unit: W/(m · K)
Conventional: 1~6W/(m · K)(silicon base)
High performance: 8~15W/(m · K)(graphite/ceramic filling)
Note: The higher the coefficient, the faster the heat transfer, but the cost and hardness usually increase
Thickness and compression ratio
Common thickness: 0.5mm ~ 5mm
Golden rule: gasket thickness = actual clearance 0.1~0.3mm (preload)
Best compression rate: 25% ~ 35% (guaranteed fit and minimum thermal resistance)
interface thermal resistance
Unit: ℃ · cm²/W
High-quality products can be as low as 0.1~0.3
Hardness/compression stress
Requirements: soft, low stress, avoid crushing chip or PCB
Other Key Features
Flame retardant: UL94 V-0 (new energy/server required)
Temperature resistance:-40 ℃ ~ 200 ℃
Low permeability oil: to prevent silicone oil pollution components
Insulation: volume resistivity> 10 ¹ ¹ Ω · cm
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