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Thermal gasket (-3.0)

Thermal gasket (-3.0)

Thermal conductive gasket -3.0 is a gap filling thermal conductive gasket with high deformation recovery rate. Its thermal conductivity can reach 1.5W/mK, and its softer hardness enables it to exhibit smaller thermal resistance under low pressure. At the same time, it excludes the air between components and circuit boards, and fully fills various rough surfaces.
Product Features
It is self-adhesive and does not require additional adhesive coating.

Product Description

Product PerformanceTest resultsTesting method
Component CompositionCeramic Grain Filled Silicone Sheet-
ColorLight blueVisually estimated
Thickness range0.020"-0.320"   (0.5-8mm)-
Proportion1.75g/cchelium true density method
Shore hardness40(Shore 00)ASTM D2240
Tensile strength15 psiASTM D412
% Elongation95ASTM D412
Shape variable @ 3mm,60psi50%ASTM D575
Operating temperature range-50℃ to 200℃-
UL fire rating94V0UL
Thermal performance
thermal conductivity1.3 W/mKHot Disk
1.5 W/mKASTM D5470
Thermal Resistance @ 40mil,20psi0.90℃-i㎡/WASTM D5470
Electrical performance
dielectric breakdown strength>250 VAC/milASTM D149
volume resistance6x1013ohm-cmASTM D257
Dielectric constant @ 1MHz5.5ASTM D150

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