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Thermal gasket (-2.0)

Thermal gasket (-2.0)

Thermal conductive gasket -2.0 is a soft gap filler thermal conductive gasket. Due to its soft hardness, it can show less thermal resistance under low pressure, while excluding the air between components and circuit boards, and fully filling all kinds of rough surfaces.
Product Features

Thermal conductive gasket-The 2.0 is self-adhesive and does not require an additional adhesive coating.

Product Description

Product PerformanceTest resultsTesting method
Component CompositionCeramic Grain Filled Silicone Sheet-
ColorLight grayVisually estimated
Thickness range0.020"-0.320" (0.5-8mm)-
Proportion3.0g/cchelium true density method
Shore hardness45(Shore OO)ASTM D2240
Tensile strength35 psiASTM D412
% Elongation85%ASTM D412
Shape variable @ 3mm/60psi40%ASTM D575
Operating temperature range-50℃ to 200℃-
UL fire rating94V0UL
Thermal performance
thermal conductivity2.4 W/mKHot Disk
2.6 W/mKASTM D5470
Thermal resistance @ 40mil/20psi0.50℃-in2/WASTM D5470
Electrical performance
dielectric breakdown strength>250 VAC/milASTM D149
volume resistance>1x1011 ohm-cmASTM D257
Dielectric constant @ 1MHz5.5ASTM D150

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