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Thermal paste (-3.5W)

Thermal paste (-3.5W)

Thermal paste -3.5W uses silicon-based materials and is a high-performance thermal paste designed for high-end CPU, GPU and custom chip assembly. Due to its excellent wetting properties, the thermal paste -3.5W can fill the tiny irregularities on the surface of the component, thereby achieving extremely low thermal resistance.
Product Features
The thermal paste -3.5W has stable performance and will not dry up, precipitate or harden. It is easy for customers to use.

Product Description

Product PerformanceTest resultsTesting method
Component CompositionSilicone Resin Filled with Ceramic Particles-
ColorGrayVisually estimated
Density2.8g/cchelium true density method
Viscosity<400,000cpsASTM D2240
Volatile (@ 150 ℃,24h)≤0.3%-
Operating temperature range-50℃ to 200℃-
Storage conditions8~28 oC-
Preservation period12 months-
Thermal performance

Thermal conductivity3.5 w/m · KHot Disk
Thermal Resistance (@ 50 ℃,50psi)0.022℃·in2/WASTM D5470
Electrical performance

volume resistivity coefficient>1.0x10 13 ohm-cmASTM D257

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