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Thermal paste (-5.5W)

Thermal paste (-5.5W)

Thermal conductive paste -5.5W is a high-performance thermal conductive paste based on silicone resin, which is used in chip components such as CPU and GPU with high heat dissipation requirements. Its excellent wettability can make it quickly fill in the interface micropores, which can greatly reduce the interface thermal resistance. The thermal paste -5.5W has stable performance, will not dry and hard under normal storage conditions, and has good thixotropy, which is convenient for customers to use.
Product Features

1. The thermal conductivity can reach 5.5 W/m K and the thermal resistance is as low as 0.06 oC cm/W.

2, ultra-low application thickness, minimum up to 20 um

3, add a large number of nanoparticles, can better fill the small gap, reduce the interface thermal resistance

4. Compliance with RoHS and REACH requirements

Product Description

Product PerformanceTest resultsTesting method
Component CompositionSilicone Resin Filled with Ceramic Particles-
ColorGrayVisually estimated
Density2.66g/cchelium true density method
Viscosity600,000 cpsHuck Rheometer
Volatile (@ 150 ℃,24h)<0.3%-
Operating temperature range-50 ℃ to 200℃-
Application thickness20 micrometers-
Fire ratingV-0UL 94
Storage life (@ 8°C to 28°C)12months-
Thermal performance

Thermal conductivity5.5 w/m · KHot Disk
5.1 w/m · KASTM D5470
Thermal Resistance (@ 80 ℃,40psi)0.049℃·c㎡/WASTM D5470
Thermal Resistance (@ 80 ℃,10psi)0.060℃·c㎡/WASTM D5470

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