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Thermal paste (-4.5W)

Thermal paste (-4.5W)

Thermal Paste -4.5W is a high-performance silicone-based thermal grease designed for high-end CPU, GPU and custom chip assembly. Due to its excellent wetting properties, the thermal paste -4.5W can fill the microscopic irregularities on the surface of the component, thereby achieving extremely low thermal resistance.
Product Features
The thermal paste -4.5W has stable performance and will not dry up, precipitate or harden. Thermal paste -4.5W easy to use, suitable for customers to operate.

Product Description

Product PerformanceTest resultsTesting method
Component CompositionSilicone Resin Filled with Ceramic Particles-
ColorGrayVisually estimated
Density2.8g/cchelium true density method
Viscosity600,000 cpsHuck Rheometer
Volatile (@ 150 ℃,24h)≤0.3%-
Operating temperature range-50℃ to 200℃-
Storage conditions8~28 oC-
Preservation period12 months-
Thermal performance

Thermal conductivity4.5 w/m · KHot DDisk
Thermal Resistance (@ 50 ℃,50psi)0.005℃·c㎡/WASTM D5470
Electrical performance

volume resistivity coefficient>1.0x10 9ohm-cmASTM D257

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