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Thermally Conductive Gel (-8.0)

Thermally Conductive Gel (-8.0)

Thermally conductive gel -8.0 is a kind of high-performance thermally conductive interstitial material, which has the characteristics of low interfacial thermal resistance and good thixotropy, and is an ideal material for large gap tolerance applications. Unlike thermal pad materials, thermally conductive gap filling materials can provide unlimited thickness changes with little or no stress on sensitive components during assembly. Thermally Conductive Gel -8.0 provide a soft, thermally conductive, form-in-place elastomer, ideal for fragile components and filling unique and complex air gaps and gaps. It fills in the need for cooling
Product Features

Thermally conductive gel -8.0 can be used manually or with dispensing equipment.

Product Description

Product PerformanceTest resultsTesting method
Component CompositionSilica Gel Filled with Ceramic Particles-
ColorOff-whiteVisually estimated
Density3.4g/cchelium true density method
Shore hardness5 (Shore OO)ASTM D2240
Viscosity/Flow @ 90psi,1"25 g/min-
Minimum bonding thickness0.15mm-
Operating temperature range-50 to 200℃-
UL fire ratingV094UL
Air flow (TML)<0.5%ASTM E595
Preservation period12 months
Thermal performance
thermal conductivity8.1W/mKHot Disk
8.2 W/mKASTM D5470
Thermal resistance @ 50psi/50 ℃0.038℃-in2/WASTM D5470

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